Completion of this 6-hour workshop consists of three 2-hour sessions covering photonic integration and packaging. It includes a live demo on photonic alignment/packaging and testing, where participants will use test equipment to test packaged photonic Integration Circuit (PIC) chips and extract parameters with Santec equipment. The workshop will test devices such as DWDM, and CWDM devices and ring resonators. Additionally, it addresses optical packaging solutions like edge couplers, grating couplers, and heterogenous techniques such as Micro-Tranfer Printing (MTP), other packaging topics will be covered, such as die attach, electrical wire bonding, package design considerations, and high-speed packaging design considerations.