HACKATHON
2026
FIRST PLACE
Distributed by:
TP

Issued to

Tejaswi Panchagnula

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Credential Verification

Issue date: September 29, 2026

ID: 82246dff-02cd-44bb-a18a-ad04f654a3a0

Issued by

Purdue University Institute of CHIPS and AI

Type

Achievement

Format

Hybrid

Description

Recognizes the team awarded First Place in the AI and Chips Hackathon. Selected from 21 submissions, the winning project demonstrated exceptional innovation, technical excellence, relevance to AI and semiconductor technologies, strong evidence of results, high-quality implementation, and an outstanding project demonstration. The team distinguished itself during the final evaluation by successfully showcasing a working solution and achieving the highest overall ranking in the competition. Following the finalist presentations, the First Place winner was selected through voting by industry guests attending the workshop, recognizing the project's exceptional technical achievement, impact, and overall excellence.