Check out Daniel Lee's IESVE Summer School: Using the IESVE for Thermal Bridging & Parametric Simulation credential issued by Integrated Environmental Solutions Ltd

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Daniel Lee

Using the IESVE for Thermal Bridging & Parametric Simulation

21st August 2026

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Pathway completed

IESVE (2026) Summer School Graduate

5/5

Credential Verification

Issue date: August 24, 2026

ID: 72abef4a-cd79-4dfb-b736-9ebe61b8cbeb

Issued by

World Leading Building Design and Analysis Software

Type

Webinar

Level

Introductory

Format

Online

Duration

2 hours

Price

Free

Description

A short introduction to the IESVE with a focus on the Thermal Bridging and Parametric applications.