Diogo Lucena
Certificate of Completion
Has successfully engaged in the following course:
Flex & Rigid-Flex Technology
This webinar offered a practical overview of Flex and Rigid-Flex PCB technologies, including when to use them, key design guidelines, and the role of PI Polyimide. It also covered crucial pre-assembly tips and highlighted the benefits and limitations of flexible circuits, helping attendees apply these solutions effectively in their PCB projects.
Erik Pedersen
FAE Director
Distributed by:
DL

Issued to

Diogo Lucena

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Credential Verification

Issue date: July 4, 2025

ID: 0e9fe88a-c5e0-4edc-82ad-91a213d7aacc

ICAPE Group logo

Issued by

ICAPE Group

Type

Certification

Description

This webinar offered a practical overview of Flex and Rigid-Flex PCB technologies, including when to use them, key design guidelines, and the role of PI Polyimide. It also covered crucial pre-assembly tips and highlighted the benefits and limitations of flexible circuits, helping attendees apply these solutions effectively in their PCB projects.

Skills

Identifying appropriate use cases for Flex & Rigid-Flex PCBs

Understanding PI Polyimide material and its applications

Applying design best practices for flexible PCB layouts

Preparing Flex & Rigid-Flex circuits for assembly and soldering

Evaluating benefits and limitations of Flex technologies