Harry Lin
Using the IESVE for Thermal Bridging & Parametric Simulation
21st August 2026
Distributed by:
HL

Issued to

Harry Lin

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Pathway completed

IESVE (2026) Summer School Graduate

5/5

Credential Verification

Issue date: August 24, 2026

ID: 048df13b-22f9-42cb-81f5-2920c2a17c1c

World Leading Building Design and Analysis Software

Type

Webinar

Level

Introductory

Format

Online

Duration

2 hours

Price

Free

Description

A short introduction to the IESVE with a focus on the Thermal Bridging and Parametric applications.